Electronic device with stacked semiconductor chips and associated manufacturing process

摘要

Production of an electronic component (1) comprises: (i) preparing a rewiring substrate (5) with connecting surfaces (6) in a central region (7) for flip-chip connections and connecting surfaces (60) in edge regions (10) of the substrate for bond connections; (ii) applying a first lower electronic component (9) formed as a semiconductor chip (2) in the central region; (iii) forming a second upper electronic component (12) having a semiconductor chip (3) and a rewiring structure (13); (iv) applying the upper electronic component on the lower electronic component; (v) forming bond connections between the outer contact surfaces of the upper electronic component and the connecting surfaces in the edge regions of the substrate; and (vi) encasing the electronic components by applying a plastic housing composition on the substrate. An Independent claim is also included for an electronic component produced by the above process.