发明名称 |
FLEXIBLE CIRCUIT BOARD, METHOD FOR MAKING THE SAME, FLEXIBLE MULTI-LAYER WIRING CIRCUIT BOARD, AND METHOD FOR MAKING THE SAME |
摘要 |
<p>There is provided a flexible circuit board 22 that, when deposited on another flexible circuit board 40, causes no gap to occur between wiring films 4a, 4a, of the flexible circuit board 40. Moreover, a plurality of flexible circuit boards are deposited on one another to provide a flexible multi-layer wiring circuit board having no gaps between the flexible circuit boards and having less bowing. In the flexible circuit board 22, the thickness of a bonding layer 16, 16a, on the opposed side of a bowing metallic member 2, of an inter-layer insulating film 10 where which bumps 6 are formed is greater than the thickness of a bonding layer on the side of metallic member 2. When the flexible circuit board 22 is deposited on the other flexible circuit board 40 to form a flexible multi-layer wiring circuit board 50, the bonding layer 16, 16a can be filled between the wiring films 4a, 4a, so that the flexible multi-layer wiring circuit board 50 has no gaps and a less bowing.</p> |
申请公布号 |
EP1626615(A1) |
申请公布日期 |
2006.02.15 |
申请号 |
EP20040732012 |
申请日期 |
2004.05.10 |
申请人 |
NORTH CORPORATION;SONY CHEMICALS CORPORATION |
发明人 |
IIJIMA, TOMOO;OSAWA, KENJI;ENDO, KIMITAKA;ECHIGO, YOSHIAKI;SHIGETA, AKIRA;KOBAYASHI, KAZUYOSHI;HANAMURA, KENICHIRO |
分类号 |
H05K1/11;H01L23/12;H05K1/00;H05K1/02;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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