发明名称 ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition giving high water resistance and surface hardness equivalent to those for conventional formaldehyde-containing resin adhesives without using any formaldehyde-containing resin, and slight in adhesive performance decline even in case of undergoing long accumulation time. SOLUTION: The adhesive composition comprises (a) a carboxyl-containing vinyl acetate-based resin emulsion, (b) an acrylamide resin and (c) an isocyanate compound, and preferably contains vegetable powder. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009084466(A) 申请公布日期 2009.04.23
申请号 JP20070257164 申请日期 2007.10.01
申请人 AICA KOGYO CO LTD 发明人 KUSHIDA MITSUGI
分类号 C09J131/04;C09J11/00;C09J11/06;C09J133/24;E04B1/98 主分类号 C09J131/04
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