PRODUCTION OF AN OPTOELECTRONIC COMPONENT THAT IS ENCAPSULATED IN PLASTIC, AND CORRESPONDING METHODS

摘要

The invention relates to a simplified method for assembling optoelectronic components that are enclosed in plastic and the construction thereof. The individual component unit contains a semiconductor chip ( 11 ) and an optical window ( 10 ). A hermetic inclusion of at least the optically active of the semiconductor chip via the window ensues in the wafer-slicing process, i.e. before separation. A (window) wafer provided with recesses ( 7 ) and occupied, in areas, by a joining layer is joined to the pre-prepared semiconductor wafer ( 1 ) via the joining layer that seals the optically active areas. Before separation, the contact areas and the separating areas of the separation are exposed by a severing ( 8 ) that is precise with regard to the recesses. An inspection measuring of the component units can ensue when the wafers are joined.