发明名称 CMP composition containing organic nitro compounds
摘要 The use of organic nitro compounds, such as nitrobenzene sulfonic acids, in chemical mechanical polishing compositions is disclosed. Chemical mechanical polishing slurries are widely used in polishing and planarizing silicon wafers and other fine surfaces. Inorganic nitro compounds are widely used in these slurries as oxidant sources. However, organic nitro compounds, particularly aromatic nitro compounds, are here suggested as advantageous substitutes.
申请公布号 US6998066(B2) 申请公布日期 2006.02.14
申请号 US20030430910 申请日期 2003.05.07
申请人 J.G. SYSTEMS, INC. 发明人 GRUNWALD JOHN
分类号 C09K13/00;C09G1/02;C09K13/06;C23F3/00;H01L21/302;H01L21/306;H01L21/321 主分类号 C09K13/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利