发明名称 |
Soldering structure between a tab of a bus bar and a printed substrate |
摘要 |
A soldering structure between a tab of a bus bar and a printed substrate is disclosed to provide a soldering structure between a tab of a bus bar and a printed substrate that causes no crack. An electrical conductive material is formed on a printed substrate. A tab through-hole is provide to penetrate the electrical conductive material and printed substrate. A tab formed by bending a body of the bus bar enters the tab through-hole. A periphery of the tab and the electrical conductive material are interconnected by soldering. A stress-absorbing aperture or recess is provided in an insulation plate on which the body of the bus bar is mounted. The stress-absorbing aperture or recess can absorb an axial stress caused in the tab.
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申请公布号 |
US6997737(B2) |
申请公布日期 |
2006.02.14 |
申请号 |
US20040898183 |
申请日期 |
2004.07.26 |
申请人 |
SUMITOMO WIRING SYSTEMS, LTD. |
发明人 |
HIWATASHI HIROKAZU |
分类号 |
H01R4/02;H01R13/58;H01R12/55;H01R43/02;H02G3/16;H05K3/20;H05K3/34;H05K7/06 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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