| 发明名称 |
Enhanced sampling methodology for semiconductor processing |
| 摘要 |
The present invention improves wafer sampling methods by partitioning a semiconductor wafer into a set of sampling regions and calculating yield of a sampling region(s) of the semiconductor wafer.
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| 申请公布号 |
US6998867(B1) |
申请公布日期 |
2006.02.14 |
| 申请号 |
US20040711201 |
申请日期 |
2004.09.01 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MERWAH PUSHKAR K. |
| 分类号 |
G01R31/28;G06F17/50 |
主分类号 |
G01R31/28 |
| 代理机构 |
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