发明名称 |
Grid array electronic component, wire reinforcing method for the same, and method of manufacturing the same |
摘要 |
Grid array electronic component, wiring-strengthening method and producing method wherein a grid array electronic component in which a grid array LSI chip 2 having a large number of lands 3 connected to a large number of lands 13 through connecting means 30 , the lands 13 are connected to a wire 4 of a printed wiring board 1 , an auxiliary land 5 is formed at a connection portion 31 of the lands 13 on the printed wiring board 1 corresponding to the lands 3 of a corner portion of the grid array LSI chip 2 connecting the wire 4 and the concentration of stress of the connection portion 31 is moderated, thereby providing the effect that the brake of the wire in the connection portion 31 is prevented.
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申请公布号 |
US6998715(B1) |
申请公布日期 |
2006.02.14 |
申请号 |
US20020088086 |
申请日期 |
2002.03.21 |
申请人 |
SUZUKA FUJI XEROX CO., LTD. |
发明人 |
FUJI SHOUICHI;NAKAO AKIRA |
分类号 |
H01L23/48;H01L23/498;H05K1/11 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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