发明名称 Grid array electronic component, wire reinforcing method for the same, and method of manufacturing the same
摘要 Grid array electronic component, wiring-strengthening method and producing method wherein a grid array electronic component in which a grid array LSI chip 2 having a large number of lands 3 connected to a large number of lands 13 through connecting means 30 , the lands 13 are connected to a wire 4 of a printed wiring board 1 , an auxiliary land 5 is formed at a connection portion 31 of the lands 13 on the printed wiring board 1 corresponding to the lands 3 of a corner portion of the grid array LSI chip 2 connecting the wire 4 and the concentration of stress of the connection portion 31 is moderated, thereby providing the effect that the brake of the wire in the connection portion 31 is prevented.
申请公布号 US6998715(B1) 申请公布日期 2006.02.14
申请号 US20020088086 申请日期 2002.03.21
申请人 SUZUKA FUJI XEROX CO., LTD. 发明人 FUJI SHOUICHI;NAKAO AKIRA
分类号 H01L23/48;H01L23/498;H05K1/11 主分类号 H01L23/48
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