发明名称 |
Thin package for stacking integrated circuits |
摘要 |
An improved structure and method for making interconnects for a thin package of stacked integrated circuits is described. The structure uses a spring contact to replace traditional solder balls in a stacked structure. The spring contacts are incorporated in an integrated circuit layer and may be made from stressed metal or physical bending of a metal structure. The spring contacts enable electrical coupling to adjacent circuit layers immediately above or immediately below the integrated circuit layer.
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申请公布号 |
US6998703(B2) |
申请公布日期 |
2006.02.14 |
申请号 |
US20030729557 |
申请日期 |
2003.12.04 |
申请人 |
PALO ALTO RESEARCH CENTER INC. |
发明人 |
DI STEFANO THOMAS H. |
分类号 |
H01L23/02;H05K1/14;H01L23/31;H01L23/48;H01L23/495;H01L25/065;H01L27/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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