| 发明名称 |
Methods of forming via plugs using an aerosol stream of particles to deposit conductive material |
| 摘要 |
An aerosol stream of particles of a conductive material is directed into a via of an integrated circuit device to deposit the conductive material within the via to form a via plug.
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| 申请公布号 |
US6998345(B2) |
申请公布日期 |
2006.02.14 |
| 申请号 |
US20040999344 |
申请日期 |
2004.11.30 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
KIRBY KYLE K. |
| 分类号 |
H01L21/441;H01L21/285;H01L21/768 |
主分类号 |
H01L21/441 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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