发明名称 SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, MODULE AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having favorable electric characteristics; or provide a semiconductor device having stable electric characteristics.SOLUTION: A semiconductor device manufacturing method comprises the steps of: forming a first transistor having a single crystal semiconductor in a channel formation region; forming an insulation film on the first transistor; forming an opening in the insulation film, which reaches the first transistor; forming a conductive film electrically connected with the first transistor via the opening; forming on the insulation film, a second transistor which is electrically connected with the conductive film and has an oxide semiconductor in a channel formation region; forming a capacitive element for electrically connecting the first transistor and the second transistor; and applying a voltage to a gate electrode of the second transistor while performing a heating treatment at a temperature of not less than 120°C and not more than 180°C.SELECTED DRAWING: Figure 1
申请公布号 JP2016092084(A) 申请公布日期 2016.05.23
申请号 JP20140222174 申请日期 2014.10.31
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 SHIMADA DAIGO;MURAKAWA TSUTOMU;KOBAYASHI HIDETOMO;TSUBUKI MASASHI
分类号 H01L21/336;H01L21/28;H01L21/822;H01L21/8234;H01L21/8242;H01L21/8247;H01L27/04;H01L27/06;H01L27/08;H01L27/088;H01L27/105;H01L27/108;H01L27/115;H01L29/417;H01L29/423;H01L29/49;H01L29/786;H01L29/788;H01L29/792 主分类号 H01L21/336
代理机构 代理人
主权项
地址