发明名称 |
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, MODULE AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having favorable electric characteristics; or provide a semiconductor device having stable electric characteristics.SOLUTION: A semiconductor device manufacturing method comprises the steps of: forming a first transistor having a single crystal semiconductor in a channel formation region; forming an insulation film on the first transistor; forming an opening in the insulation film, which reaches the first transistor; forming a conductive film electrically connected with the first transistor via the opening; forming on the insulation film, a second transistor which is electrically connected with the conductive film and has an oxide semiconductor in a channel formation region; forming a capacitive element for electrically connecting the first transistor and the second transistor; and applying a voltage to a gate electrode of the second transistor while performing a heating treatment at a temperature of not less than 120°C and not more than 180°C.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016092084(A) |
申请公布日期 |
2016.05.23 |
申请号 |
JP20140222174 |
申请日期 |
2014.10.31 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
SHIMADA DAIGO;MURAKAWA TSUTOMU;KOBAYASHI HIDETOMO;TSUBUKI MASASHI |
分类号 |
H01L21/336;H01L21/28;H01L21/822;H01L21/8234;H01L21/8242;H01L21/8247;H01L27/04;H01L27/06;H01L27/08;H01L27/088;H01L27/105;H01L27/108;H01L27/115;H01L29/417;H01L29/423;H01L29/49;H01L29/786;H01L29/788;H01L29/792 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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