| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device where excellent high adhesiveness between a seal and a lid of glass surface etc. through an adhesive layer is attained. SOLUTION: In the optical semiconductor device which consists of the seal housing an optical semiconductor element and consisting of epoxy resin and the transparent lid connected with the seal through an adhesive; the adhesive is an epoxy-based adhesive, the seal consists of the hardened matter of an epoxy resin component, the resin component contains epoxy resin having biphenyl skeleton, the coefficients of the linear expansion of the hardened matter at 50°C is 8 to 13 ppm, and the elastic modulus of the linear expansion of the hardened matter at 50°C is 16 to 28 GPa. The optical semiconductor device has excellent high adhesiveness between the seal and the lid. COPYRIGHT: (C)2006,JPO&NCIPI
|
