| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film surface acoustic wave device for preventing the damage of a board circuit by a surface acoustic wave element forming process and reducing variation in a parasitic capacity, and to provide a method for manufacturing the device, and a hybrid integrated circuit device. SOLUTION: The thin film surface acoustic wave device 100 comprises a board 101 with a circuit 110 formed in one front layer part; a piezoelectric body thin film 104 which is formed on the board at the opposite side of the one surface layer part; and electrodes 105Ax, 105Ay, 105B which are formed on the front surface of the piezoelectric body thin film 104. The electrodes 105As, 105Ay, and 105B are connected by conduction with the circuit 110 via at least wiring 113 which passes on the side surface of the board 101. COPYRIGHT: (C)2006,JPO&NCIPI
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