| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable wiring board in which the strength of adhesion between a resin and metal foil is increased, and to provide a method of manufacturing the board. SOLUTION: The wiring board contains a substrate 42 and wiring patterns 44 formed on the substrate 42. Each wiring pattern 44 contains a plurality of wires 46. Each wire 46 contains first and second terminals 38 and 40 and the connection 52 of the terminals 38 and 40. In addition, the surfaces of the first terminals 38 are roughened and the surfaces of the wiring patterns 44 are glossed except the portions of the first terminals 38. COPYRIGHT: (C)2006,JPO&NCIPI
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