| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP device, a CMP polishing method, and a manufacturing method for a semiconductor device by which a guide ring can be used almost to its use limit without wastefully disposing it. <P>SOLUTION: The CMP device 11 has a top ring 46 for holding a semiconductor wafer 44 by sucking it, a retainer ring 45 for guiding the side face of the semiconductor wafer 44, a polishing pad 41 for polishing the semiconductor wafer 44, and a CCD camera 42. When the semiconductor wafer 44 is polished, the retainer ring 45 guiding the semiconductor wafer 44 is also polished together with the semiconductor wafer 44. A groove, which discharges abrasive powder generated when the semiconductor wafer 44 is polished, is provided to the retainer ring 45. The depth of the groove is calculated by processing an image of the groove with an image processing part after taking in the image of the groove by the CCD camera 42. The use limit of the retainer ring 45 is controlled by confirming the depth as needed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
