| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent damages caused by scattering of a fuse on a circuit element, a wiring and a semiconductor substrate. SOLUTION: In the semiconductor device, an insulating layer is formed on the semiconductor substrate provided with the circuit element on the surface, the fuse to be trimmed with a laser is formed on the insulating layer, and a protection film is formed on the fuse. At least one or more cavities are formed in the vicinity of the fuse. COPYRIGHT: (C)2006,JPO&NCIPI
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