Method of making bondable leads using positive photoresist and structures made therefrom

摘要

A microelectronic component having a plurality of leads are formed at their tip end with bondable material using a process including a mask of positive photoresist material. The leads can be rendered peelable from the substrate by, for example, plasma undercutting the leads. The tip ends of the leads can be bonded to contacts on an opposing microelectronic component, and separated therefrom in horizontal direction by virtue of the peelable leads to form S-shaped leads. The space between the microelectronic components can be filled with a compliant layer to form a microelectronic package.