发明名称 |
Wafer guides for processing semiconductor substrates |
摘要 |
A wafer guide used in cleaning and/or drying processes of semiconductor wafers is provided. The wafer guide includes a horizontal support panel and at least three vertical panels attached on one surface of the support panel. Each of the vertical panels has a vertical body panel and a plurality of protrusions upwardly extended from a top surface of the vertical body panel. Gap regions between the protrusions act as slots for holding wafers. Sidewalls of the slots have a convex shaped profile when viewed from a top view, and bottom surfaces of the slots also have a convex shaped profile when viewed from a cross sectional view that crosses the vertical panels. Accordingly, contact areas between the wafers and the wafer guide are reduced to improve a drying efficiency of the wafers.
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申请公布号 |
US2006027513(A1) |
申请公布日期 |
2006.02.09 |
申请号 |
US20050234033 |
申请日期 |
2005.09.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
JUN PIL-KWON;PARK SANG-OH;KO YONG-KYUN;YI HUN-JUNG |
分类号 |
A47G19/08;H01L21/304;B65D25/10;H01L21/00;H01L21/673 |
主分类号 |
A47G19/08 |
代理机构 |
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