发明名称 CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a circuit device having improved positioning accuracy of a built-in circuit element, and to provide a manufacturing method thereof. <P>SOLUTION: The manufacturing method of the circuit device forms a first recognition pattern 20 and a second recognition pattern 21 for each circuit device. A circuit element 15 is settled by recognizing position information of a conductive pattern using the first recognition pattern 20. The position of the settled circuit element 15 is confirmed by using the second recognition pattern 21. Accordingly, the positional accuracy of the circuit element can be improved, by checking the allocating position using the recognition pattern different from that used for arrangement and then feeding back such positional information. Moreover, inclination of the first circuit element 15A can be controlled, to further improve the positional accuracy, by allocating the first circuit element 15A on the divided fine dummy pattern. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006041019(A) 申请公布日期 2006.02.09
申请号 JP20040215706 申请日期 2004.07.23
申请人 SANYO ELECTRIC CO LTD 发明人 HOSOI TOSHIRO;NAKAMURA TAKESHI
分类号 H01L25/18;H01L23/12;H01L25/065;H01L25/07 主分类号 H01L25/18
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