| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pattern forming material which is used for manufacturing a printed wiring board, excels in property of following roughness, and can suppress lowering of the sensitivity of a photosensitive layer, in which the photosensitive layer can be laminated at a low temperature and can be transferred in a short period of time since preheating of a substrate is made unnecessary, and which can suppress edge fusion phenomenon, and to provide a pattern forming apparatus provided with the pattern forming material and a pattern forming method using the pattern forming material. <P>SOLUTION: The pattern forming material has a cushion layer and a photosensitive layer on a support, wherein at least one of the cushion layer and the photosensitive layer contains a polymacromonomer obtained by polymerizing a macromonomer. The pattern forming apparatus provided with the pattern forming material is also provided. In the pattern forming method, exposure is performed using the pattern forming material. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
