| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a flexible printed circuit board which can simplify a step of delaminating an organic film covering terminals of the board to reduce a manufacturing cost, and also to provide a method for manufacturing an electro-optical device. SOLUTION: In a first step, a semiconductor element and first terminals 35 for electrically connecting the semiconductor element with an external device are formed on a substrate 20, and an organic film 37 is formed to cover the first terminals 35. Second terminals 55 of a flexible printed circuit board 50 electrically connected to the substrate 20 are pressed from above of the organic film 37 to be directed toward the first terminals 35 and to be conducted with the first terminals 35. An anisotropic paste 61 or an anisotropic conductive film 60 is disposed between the second terminals 55 and the organic film 37. COPYRIGHT: (C)2006,JPO&NCIPI |
