RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor encapsulation having excellent tracking resistance. SOLUTION: The resin composition for semiconductor encapsulation contains an epoxy resin, a curing agent, an inorganic filler and a cure accelerator. The epoxy resin is expressed by formula (A) and the curing agent is a novolak phenolic resin having a dicyclopentadiene skeleton. COPYRIGHT: (C)2006,JPO&NCIPI