| 摘要 |
PROBLEM TO BE SOLVED: To improve the durability of a thermoelement against thermal stress. SOLUTION: The thermoelement 1 is provided with a diaphragm 2, a thermoelectric semiconductor crystal 3 penetrating the diaphragm 2 which is fixed onto the diaphragm 2, an upper electrode 4 bonded with the top end of the thermoelectric semiconductor crystal 3, and a lower electrode 5 bonded with the bottom end of the thermoelectric semiconductor crystal 3. An upper metallic thin plate cover 8 is adhered above the upper electrode 4 with an adhesive agent made of a silicone resin or a grease 6, and a lower metallic thin plate cover 9 is adhered under the lower electrode 5 with an adhesive agent made of a silicone resin or a grease 7. The metallic thin plate covers 8 and 9 theirselves absorb a thermal stress and alleviate it, and the electrodes 4 and 5 are adhered by the adhesive agent made of a silicone resin or the greases 6 and 7. Therefore, the thermal stress applied to the electrodes 4 and 5 and the thermoelectric semiconductor crystal 3 is greatly reduced, and the service life of the thermoelement 1 can be greatly prolonged as a result. COPYRIGHT: (C)2006,JPO&NCIPI |
