| 摘要 |
PROBLEM TO BE SOLVED: To promote miniaturization of a high-frequency module and to achieve reduction in cost. SOLUTION: A crystal vibrator 6 is attached on the side face of a circuit board 2 of the high-frequency module 1 to reduce the circuit board 2 in size, thereby miniaturizing the high-frequency module. COPYRIGHT: (C)2006,JPO&NCIPI
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