| 摘要 |
A film carrier tape for mounting electronic components includes comprises an insulating film and, on the surface thereof, an inner connection terminal, an outer connection terminal and wiring for connecting these terminals, and further includes a solder resist layer covered in such a way that the connection terminals are exposed, and the tape secures an electrical connection of a connection terminal of an electronic component and the inner connection terminal by applying an ultrasonic wave on the inner connection terminal in mounting the electronic component. The wiring positioned from a part where the inner connection terminal is electrically connected with the connection terminal of the electronic component to the edge of the solder resist layer and wiring in a 1000 mum length from the edge of the solder resist, which wiring is protected by the solder resist layer, are formed in an almost straight shape. The film carrier tape for mounting electronic components having the above structure does not receive any concentration of stress when an ultrasonic wave is applied and thereby cracks or disconnections in the wiring pattern are virtually eliminated.
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