发明名称 Reinforced probes for testing semiconductor devices
摘要 A probe card assembly is provided. The probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer.
申请公布号 US2006028220(A1) 申请公布日期 2006.02.09
申请号 US20050184581 申请日期 2005.07.19
申请人 K&S INTERCONNECT, INC. 发明人 MALANTONIO EDWARD L.;LAURENT EDWARD;HANOON ILAN;HMIEL ANDREW;TUNABOYLU BAHADIR;NGUYEN ANH-TAI T.;TRAN LICH
分类号 G01R31/02 主分类号 G01R31/02
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