| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method and an apparatus which performs very precise face down bonding by automatically correcting positional deviations before and after bonding. SOLUTION: The bonding apparatus contains a two-vertical-field-of-view camera 3 for photographing a circuit board 5 having a bump formation surface for a semiconductor chip 8 and an opening 51, and a lower camera 4 which is located below a substrate mounting portion 1 and photographs a region including the opening 51 of the circuit board mounted on the substrate mounting portion 1. After bonding the semiconductor chip 8 on the circuit board 5 by moving around a bonding head 2, a pattern for positional correction of the semiconductor chip 3 bonded on the circuit board 5 is photographed by the lower camera 4. Thereafter, bonding errors are calculated using the positional information on the pattern for positional correction, and then the amount of movement of the bonding head 2 at the time of bonding is corrected based on the bonding errors. COPYRIGHT: (C)2006,JPO&NCIPI
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