发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which has a high content of a silica filler having a small particle size, is high in fluidity, and is excellent in heat resistance and moisture resistance. SOLUTION: The resin composition comprises a spherical silica particle having an average particle size of 0.1μm or more and 5μm or less and sphericity of 0.8 or more, a silica nano-particle having an average particle size of 1 nm or more and 50 nm or less, and one or more resins selected from a heat- or light-curable resin and a thermoplastic resin. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006036915(A) 申请公布日期 2006.02.09
申请号 JP20040218703 申请日期 2004.07.27
申请人 ADMATECHS CO LTD 发明人 NOYA MASAHITO;ABE SAN;YANAGIHARA TAKESHI;HORI KENTA
分类号 C08L101/00;C08K3/36;C08K7/18;C08L33/06;C08L63/00;H01L23/29;H01L23/31 主分类号 C08L101/00
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