发明名称 |
Halbleitervorrichtung mit Klemmen zum Verbinden mit externen Elementen |
摘要 |
A semiconductor device that has a semiconductor die having at least two opposing major electrodes and a control electrode. Conductive clips, each having a base portion and a contact portion, are connected to respective electrodes at their bases by a respective layer of conductive material. A passivation layer is disposed on at least one of the electrodes and surrounds the layers of conductive material. The base portion and the contact portion of one of the clips are connected by an extension, which extends between the major surfaces of the semiconductor die. |
申请公布号 |
DE10393769(T5) |
申请公布日期 |
2006.02.09 |
申请号 |
DE2003193769T |
申请日期 |
2003.11.21 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION, EL SEGUNDO |
发明人 |
STANDING, MARTIN |
分类号 |
H01L21/60;H01L23/48;H01L23/492;H01L23/495;H01L23/52;H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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