COATING FILM FORMING APPARATUS AND COATING FILM FORMING METHOD

摘要

A wafer (W) is carried into a case (3) by a transfer arm mechanism (A2), the wafer (W) is rotated by a spin chuck (31), and a coating liquid is supplied to the wafer (W) from a nozzle (5) and a coating film is formed. At the time of carrying out the wafer (W) from the case (3) after coating, image data of the surface of the wafer (W) is taken by a line sensor (72), and based on the image data, a judgment program (83c) judges existence of coating nonuniformity.