| 摘要 |
<p>A system and method for assembly of semiconductor dies to flexible circuits, wherein the present invention utilizes UV release tape as a temporary, removable carrier for precisely aligning, and maintaining the alignment of, a semiconductor die, and more specifically, the interconnecting pads thereof, with the conducting leads of a flexible circuit; thereby, expediting subsequent permanent affixation of same via thermo-sonic TAB bonding processes, or the like.</p> |
