| 发明名称 |
CONNECTION MEMBER AND MOUNT ASSEMBLY, AND PRODUCTION METHOD OF THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection member which can be produced without a via-forming step. <P>SOLUTION: The connection member 100 includes: an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10a, and a side surface 10c which connects these surfaces; and at least one wire 20 which extends from the upper surface to the lower surface through the side surface. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2006040870(A) |
申请公布日期 |
2006.02.09 |
| 申请号 |
JP20050037978 |
申请日期 |
2005.02.15 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
ASAHI TOSHIYUKI;KARASHIMA YASUHARU;ICHIYANAGI TAKASHI;NAKATANI SEIICHI;NISHIYAMA TOSAKU;HIRANO KOICHI;SHIBATA OSAMU;NAKAYAMA TAKESHI;SAITO YOSHIYUKI |
| 分类号 |
H01R11/00;H01L23/12;H01L25/10;H01L25/11;H01L25/18;H01R43/00;H05K1/11;H05K1/14;H05K1/18;H05K3/36;H05K3/40 |
主分类号 |
H01R11/00 |
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