| 摘要 |
<P>PROBLEM TO BE SOLVED: To inhibit peeling of the photoresist film of the edge part of a large-sized substrate or a thin film. <P>SOLUTION: When circuit patterns 51a-51d formed in a reticle 50 are transferred to a resist film on a large-sized substrate 1 which picks a plurality of semiconductor devices and patterned, a non-exposure region 1b of fixed width to which the circuit patterns 51a-51d are not transferred, is formed by a substrate edge blind 41 on the entire periphery of the edge part 1a of the large-sized substrate 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
