| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive column(column body) manufacturing method which is applicable to manufacturing of circuit board, and improves the yield of the conductive column in the circuit board. SOLUTION: The circuit board has a dielectric layer. A first blind hole is formed in the dielectric layer from the side of first surface of the dielectric layer, and a second blind hole is formed in the dielectric layer from the side of second surface opposite to the side of the first surface; and the blind end of the first blind hole and the blind end of the second blind hole are connected. The first blind hole and second blind hole constitute a through hole, and the shape of the through hole is formed like a sandglass so that the inner diameter of the through hole near the first or second surface becomes significantly larger than the inner diameter near the center of the through hole. The conductive column is formed, by filling a conductive material in the through hole. Since the through hole is in a shape of a sandglass, The conductive material can be easily filled into the through hole, thereby, the yield of the conductive column can be effectively enhanced. COPYRIGHT: (C)2006,JPO&NCIPI |
