| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing device and a dicing method wherein a misalignment in position of a chip after cut and separated from a wafer can be prevented, and the lack of the chip after dicing can be prevented. SOLUTION: The dicing device comprises a wafer fixing sheet 18 to which a plurality of wafers W are stuck, a sheet retaining tool 30 which adheres to and retains the sheet 18, and is formed with a through hole 32 at a location corresponding to the wafer W stuck to the sheet 18, a dicing table 12, and a vacuum sucking means 28 for air-sucking from a first sucking hole 20 and a second sucking hole 22. The dicing table 12 has a projection 14 which is fitted to the through hole 32, and has a height of a substantially same dimension as a thickness dimension of the tool 30; the first sucking hole 20 provided at a location opposing to a stuck area of the sheet 18 to which the wafer W is stuck, on an upper face of the projection 14; a groove 16 provided at a location opposing to a non-stuck area of the sheet 18 to which the wafer W is not stuck, on the upper face of the projection 14; and the second sucking hole 22 provided on the base of the groove 16. COPYRIGHT: (C)2006,JPO&NCIPI |
