ALUMINUM-ALLOY SILICON-CARBIDE COMPOSITE

摘要

PROBLEM TO BE SOLVED: To provide an aluminum-alloy silicon-carbide composite which is suitable for a base plate of a circuit board and has a high thermal conductivity even in a high temperature region and has a low coefficient of thermal expansion. SOLUTION: The aluminum alloy-silicon carbide composite is obtained by first preparing a composite having such a structure that an aluminum plate is interleaved inside a silicon carbide porous material body and then making it impregnated with an aluminum alloy. The ratio of thickness of the aluminum plate to that of the silicon carbide porus material body is within a range of 1:9 to 6:4. COPYRIGHT: (C)2006,JPO&NCIPI