| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrooptical device, an electronic equipment equipped with the electrooptical device and a mounting structure with which a mutual connection state of terminals in a mounting section is easily diagnosed when an IC is mounted on a substrate directly or via a wiring substrate. SOLUTION: In the electrooptical apparatus 1a, when connection states both between a bump 51 and a pad 41 and between a bump 52 and a pad 42 are good, a signal outputted from a diagnosis section 58 to the bump 52 is inputted as it is to the diagnosis section 58, via the pad 42, a conductive pattern 81 for diagnosing the connection state, the pad 41 and the bump 51. On the other hand, when a connection failure either between the bump 51 and the pad 41 or between the bump 52 and the pad 42 occurs, the signal outputted from the diagnosis section 58 to the bump 52 is not inputted from the bump 51 to the diagnosis section 58. COPYRIGHT: (C)2006,JPO&NCIPI
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