| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation, having characteristics with good mold releasability and continuous moldability in molding and excellent in soldering resistance. SOLUTION: The epoxy resin composition for semiconductor encapsulation comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) an oxidized polyethylene wax, (F) a silane coupling agent and (G) a compound each of≥2 adjacent carbon atoms constituting an aromatic ring of which is bonded to a hydroxy group, as essential ingredients. At least one of (A) the epoxy resin and (B) the phenol resin is a resin having a novolac structure with a biphenylene skeleton in the main chain. The content of the (E) component is 0.01-1wt% based on the whole epoxy resin composition and the content of the (G) component is 0.01-1wt% based on the whole epoxy resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
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