| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors exhibiting excellent visibility of laser marks, and a semiconductor device sealed using the epoxy resin composition for sealing semiconductors. SOLUTION: The epoxy resin composition for sealing semiconductors comprises an epoxy resin, a curing agent, an inorganic filler and a colorant, where the colorant comprises at least either one of carbon black and a black dye and the content of carbon black is within the range of 0.001-0.1 mass% while the content of the black dye is within the range of 0.01-0.2 mass%. COPYRIGHT: (C)2006,JPO&NCIPI
|
