| 发明名称 |
Methods of processing substrates during semiconductor manufacturing processes |
| 摘要 |
The present invention provides methods of processing a substrate by contacting the substrate with an inorganic solution including an organic additive, rinsing the substrate with an organic alcohol, and rinsing the substrate with deionized water. Related substrates and devices are also disclosed.
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| 申请公布号 |
US2006027252(A1) |
申请公布日期 |
2006.02.09 |
| 申请号 |
US20050193088 |
申请日期 |
2005.07.29 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MUN CHANG-SUP;HONG CHANG-KI;CHOI SANG-JUN;KO HYUNG-HO;KIM SANG-YONG |
| 分类号 |
B08B3/00 |
主分类号 |
B08B3/00 |
| 代理机构 |
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