发明名称 High mobility CMOS circuits
摘要 Semiconductor structure formed on a substrate and process of forming the semiconductor. The semiconductor includes a plurality of field effect transistors having a first portion of field effect transistors (FETS) and a second portion of field effect transistors. A first stress layer has a first thickness and is configured to impart a first determined stress to the first portion of the plurality of field effect transistors. A second stress layer has a second thickness and is configured to impart a second determined stress to the second portion of the plurality of field effect transistors.
申请公布号 US2006027868(A1) 申请公布日期 2006.02.09
申请号 US20050244291 申请日期 2005.10.06
申请人 IBM CORPORATION 发明人 DORIS BRUCE B.;GLUSCHENKOV OLEG G.;ZHU HUILONG
分类号 H01L27/12;H01L21/8238;H01L27/01 主分类号 H01L27/12
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