| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and thin optical semiconductor device in which a translucent lid has high precision parallelism, the translucent lid and an insulating substrate are bonded rigidly to ensure excellent airtigtness of an enclosed space for containing the optical semiconductor element, the optical semiconductor element can receive external light normally with no distortion over a long term, and a normal electric signal can be delivered to an external apparatus, element, or the like. SOLUTION: The optical semiconductor device 9 comprises an insulating substrate 1 provided, in the upper surface thereof, with a recess 1a for containing an optical semiconductor element 3, a wiring conductor 2 led out from the inside of the recess 1a in the insulating substrate 1, the optical semiconductor element 3 bonded to the bottom face of the recess 1a and having an electrode connected electrically with the wiring conductor 2, and a translucent lid 5 being fixed to the upper surface of the insulating substrate 1 through a bonding material 7 to close the recess 1a wherein the insulating substrate 1 is bonded, to the periphery on the upper surface thereof, with the translucent lid 5 through the bonding material 7 filling a groove 1b. COPYRIGHT: (C)2006,JPO&NCIPI |
