| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, useful for an insulating material for use in flexible circuit boards, capable of readily forming a conductor layer superior in adhesive strength by plating. SOLUTION: This thermosetting resin composition comprises (A) a linear modified polyimide resin obtained by reacting a polybutadiene of difunctional terminal hydroxy groups, a diisocyanate compound and a tetrabasic acid anhydride, and (B) one or more thermosetting resins selected from the group consisting of an epoxy resin, a bismaleimide resin, a cyanate ester resin, a bisallylnadide resin, a vinyl benzil ether resin, a benzoxazine resin, and a polymer of a bismaleimide and a diamine. COPYRIGHT: (C)2006,JPO&NCIPI |
