| 摘要 |
PROBLEM TO BE SOLVED: To hardly damage terminals and near positions thereof relating to a semiconductor device and a method of manufacturing the semiconductor device. SOLUTION: The semiconductor device is provided with a semiconductor element, resin 22 for sealing the semiconductor element, and terminals 18 stuck to the resin 22 so as to be exposed from the resin 22. It is constituted that the terminals 18 are connected with terminals of the semiconductor element and are partially embedded in the resin 22. COPYRIGHT: (C)2006,JPO&NCIPI |
