| 摘要 |
PROBLEM TO BE SOLVED: To mix and package an electronic component to be mounted on a surface and an electronic component with a lead terminal on a printed wiring board through simple processing steps. SOLUTION: A solder 3 is provided beforehand in the solder pool 1a of a lead terminal 1 in an electronic component 10 (lead insertion component) with the lead terminal and by performing reflow heating treatment, while inserting the lead terminal 1 into a through-hole on a printed wiring board coated with cream solder, the inside of the through-hole can be filled with the dissolved solder 3, thereby packaging the lead insertion component 10 on the printed wiring board. This lead insertion component 10 can be mixed and simultaneously packaged on the printed wiring board together with the surface-mounted electronic component (chip component) by reflow heating treatment. COPYRIGHT: (C)2006,JPO&NCIPI
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