| 摘要 |
PROBLEM TO BE SOLVED: To provide a tool for flow soldering to realize the soldering process with a method for flow soldering of electronic component to a printed wiring board without provision of a waste land. SOLUTION: The tool for flow soldering 1 is loaded to a printed wiring board 100 for soldering an electronic component 101 to the printed wiring board 100 with the flow soldering method; and comprises an aperture 12 for exposing the predetermined region including the soldering portion of the printed wiring board 100, and a masking part 13 for masking the regions other than the predetermined region. The aperture 12 is provided with a soldering wet part 15 which is formed of a wettable material at the side wall of up-stream side for the transfer direction B of the printed wiring board 100. COPYRIGHT: (C)2006,JPO&NCIPI
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