发明名称 SOLDER PASTE
摘要 PROBLEM TO BE SOLVED: To obtain a solder paste for forming a soldered joint that excels in durability including cold cycle resistance and crack resistance. SOLUTION: This solder paste contains a flux containing thermosetting resin and/or thermoplastic resin, a resin filler powder coated with a metallic layer, and a solder alloy powder. Alternatively, the solder paste contains a flux containing thermosetting resin and/or thermoplastic resin and a resin filler powder coated with a solder alloy layer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006035259(A) 申请公布日期 2006.02.09
申请号 JP20040218318 申请日期 2004.07.27
申请人 DENSO CORP;HARIMA CHEM INC 发明人 MITSUHARU MASAKI;YAMAMOTO MASAYASU;AIHARA MASAMI;INOUE TAKASUKE;KUMAMOTO SATOSHI
分类号 B23K35/22;H05K3/34 主分类号 B23K35/22
代理机构 代理人
主权项
地址