| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sputter electrode structure having a magnet mechanism in which a sputter target has a truncated-conical side view shape, and is arranged to obtain the line of magnetic force, the film thickness distribution is improved by changing the magnetic field generated by a magnet mechanism of a simple structure, and erosion of the sputter target is uniformized. <P>SOLUTION: In the sputter electrode structure, a sputter electrode which emits sputter particles to a substrate arranged in a vacuum container under the applied voltage comprises a sputter target having a truncated-conical side view shape arranged in an inclined manner to the substrate, a magnet mechanism which is provided on the back side of the sputter target to generate the line of magnetic force along the surface of the sputter target, and a magnetic field varying means to vary the magnetic field generated by the magnet mechanism. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
