| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding apparatus for laser crystals that performs sticking in a laser crystal surface by very uniform and high heat conduction, and that will not damage the laser crystal and a reflection control film added to the surface of the laser crystal. SOLUTION: The die bonder for sticking the laser crystal to a heatsink has a pin 7, that is vertically slidable from a pin retention 8 by a spring 9 arranged between the pin retainer 8 with which a pin pedestal 10 is engaged and a pin collar 7A. In this case, the tip surface of the pin 7 is brought into contact with the upper portion of the laser crystal 6, and the laser crystal 6 is pressed against a heatsink 4 with a prescribed pressure for heating to fix the laser crystal 6 to the heatsink 4. COPYRIGHT: (C)2006,JPO&NCIPI |
