| 摘要 |
PROBLEM TO BE SOLVED: To provide the dividing method of a wafer capable of dividing the wafer into individual devices without deteriorating the quality of the devices and a divider of the same. SOLUTION: The wafer is divided in which a plurality of predetermined division lines are formed in a lattice, and a plurality of devices comparted by a plurality of the predetermined division lines on the surface of the wafer are cut off along the predetermined division lines while rotating a cutting blade held on a chuck table and supplying a cutting fluid thereto. The dividing method comprises a protective film forming step of forming the protective film on the surface of the wafer by coating a coating liquid having freezing point higher than the temperature of the cutting fluid on the surface of the wafer to solidify the coating liquid at a temperature lower than the freezing point; and a cutting step of cutting the wafer along the predetermined division lines while rotating the cutting blade, and supplying the freezing fluid at the temperature lower than the freezing point, with the wafer of the protective film formed on the surface of the wafer held on the chuck table. COPYRIGHT: (C)2006,JPO&NCIPI |
